Wireless

Up Screening, LAT, Element Evaluation & More

TMS VALUE ADDED SERVICES At-A-Glance
  • Full RF and DC testing up to 40 GHz
  • Up Screening / LAT to MIL-PRF-19500, 38534, 38535 and MIL-STD-883 for Military and Space
  • Space Level Screening: K-level, S-level, and H-level
  • Up Screening & Testing of GaN devices
  • Verification & Testing of Counterfeit Parts
  • Space Level Screening & Qual for plastic encapsulated devices per NASA PEM-INST-001
  • LAT and Up Screening on FETS & MMICs, Bipolar Transistors, and Diodes
  • Packaging and Screening of Active Die
  • Build to Print Assembly: simple die / complex hybrids, hermetic sealing, passive / active components
For over three decades, Teledyne Microwave Solutions (TMS) has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, TMS offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. TMS offers a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.

 

MICROCIRCUIT & SEMICONDUCTOR DIE EVALUATION

​Examples of full Microcircuit and Semiconductor Die evaluation per MIL-PRF-38534 are shown below. Teledyne Microwave Solutions supports other industry standard and custom screening and evaluation sequences, including:

 CLASS H CLASS K
Element Electrical
Element Visual
Internal Visual
Final Electrical
Wire Bond Evaluation
Attribute Data/
Certificate of Conformance
Element Electrical
Element Visual
Internal Visual
Temperature Cycling
Constant Acceleration
Interim Electrical
Burn-in
Post Burn-in Electrical
Steady State Life
Final Electrical
Wire Bond Evaluation
SEM Examination
Attribute Data/
Certificate of Conformance

DIE SERVICES

​Teledyne Microwave Solutions (TMS) offers full die handling services including quick, reliable and cost-effective sorting of die. Our die services help you maintain a consistent flow of die to your manufacturing environment in the volumes and at the quality level you need, while increasing the reliability and manufacturability of COT parts. TMS also provides qualified die through 100% visual inspection and LAT (Lot Acceptance Testing) for space and military level applications.

Die Visual, Sorting and Packaging
  • Store Wafers (Dry Nitrogen Desiccators)
  • Die Visual
    • Commercial Level
    • Military Level and S-Class to MIL-PRF-19500, MIL-STD-750, MIL-STD-883, MIL-PRF-38534, MIL-PRF-38535
  • Die Package in Waffle or Gel Packs
    • Facilitate automated pick-and-place or manual transfer
TMS typically up screens active dye from the following die manufacturers:
  • Avago
  • Fujitsu/Eudyna
  • NEC
  • RFMD
  • MA/COM
  • TriQuint
  • M-Pulse
  • Skyworks
  • CTC
  • NXT
  • Hittite

ELECTRICAL TEST CAPABILITIES

​Teledyne Microwave Solutions (TMS) has full DC, RF and microwave test capabilities for your comprehensive element, hybrid, component, and subassembly testing requirements. Using fully documented and controlled test procedures, TMS can quickly provide go / no-go or complete RF test results from ambient to full military/space temperature extremes. Customers may specify the testing parameters, temperatures and data format they desire and obtain quick, accurate, and reliable results.

MARKET APPLICATIONS & KEY PROGRAMS

​Market Applications
  • Military: EW, Radar, Missiles
  • Space: Satellite, Military
  • Industrial
Key Heritage Programs
  • Patriot
  • Lunar Probe
  • Euro Fighter
  • Classified Space
  • GPS
  • Laser
  • AEHF

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